Description
- Two-part, optically clear, solvent free, low viscosity silicone
- Cures at room temperature or rapidly with heat
- Offers good physical and electrical stability across a broad range of temperatures
- 10:1 Mix Ratio (Part A:Part B)
Applications
- To provide protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals and other environmental hazards by potting or encapsulating
- For photonics applications
- For applications requiring an operating temperature range of -65 to 240°C (-85 to 465°F)
Product Details
| Property | Average Result |
|---|---|
| Cure System | Platinum |
| Viscosity | 5,300 cP (5,300 mPa*s) |
| Durometer | 50 Type A |
| Tensile | 1,300 psi (8.97 MPa) |
| Elongation | 95 % |
| Appearance | Clear |
| Cure | 15 minutes / 150 °C |
| Dielectric Strength | 500 volts/mil (19.5 kV/mm) |
| Mix Ratio | 10:1 |
| Operating Temperature | -65 °C / 240 °C |
| Refractive Index | 1.41 |
| Specific Gravity | 1.03 |
| Tear | 20 ppi (3.53 kN/m) |
| Volume Resistivity | 1,100,000,000,000,000 ohmcm |
| Work Time | 4 hours |
| Comment | Self leveling, low temperature cure versatile encapsulant |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.