R-2175

THERMALLY CONDUCTIVE SILICONE POTTING ELASTOMER

Description

  • Two part, Black, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant
  • Tested per UL-94 and passed V-0

Applications

  • Thermally stable, flowable material that cures at room temperature
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Applications include: potting for connectors, sensors, relays, power devices and other electronic components requiring protection from vibration and generally harsh environmental conditions

Product Details

Property Average Result
Thermal Conductivity 0.4 W/(mK)
Viscosity 2,000 cP (2,000 mPa*s)
Cure System Platinum
Tensile 525 psi (3.62 MPa)
Appearance Black
Cte
Cure 60 minutes / 150 °C
Dielectric Strength 580 volts/mil (22.62 kV/mm)
Durometer 50 Type A
Elongation 130 %
Mix Ratio 1:1
Volume Resistivity 43,000,000,000,000 ohmcm
Work Time 1 hours
Comment 0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.