R-2165

THERMALLY CONDUCTIVE SILICONE POTTING ELASTOMER

Description

  • Two part, Gray, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant

Applications

  • Enhanced thermal conductivity for removal of heat and improved reliability
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Quick set-up and flexible cure schedule
  • Applications include: potting for sensors, relays, and other electronic components requiring protection from vibration and generally harsh environmental conditions

Product Details

Property Average Result
Thermal Conductivity 0.5 W/(mK)
Viscosity 4,000 cP (4,000 mPa*s)
Cure System Platinum
Tensile 500 psi (3.45 MPa)
Appearance Gray
Cte
Cure 10 minutes / 150 °C
Dielectric Strength 700 volts/mil (27.3 kV/mm)
Durometer 60 Type A
Elongation 100 %
Mix Ratio 1:1
Volume Resistivity 1,000,000,000,000,000 ohmcm
Work Time 10 minutes
Comment 0.6 W/mK, versatile, moderate thermally conductive silicone. Will RTV.

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.