LS-3238

ENCAPSULATION GEL

Description

  • A two-part, encapsulation gel
  • Extended work time
  • 1:1 Mix Ratio (Part A:B)

Applications

  • For protection of sensitive photonics assemblies from mechanical shock, thermal shock, dust, and ambient atmosphere
  • Extended work time allows voids in complex assemblies to fill in and permits time for any trapped air bubbles to float to the fluid surface and escape
  • For applications requiring an operating temperature range of -40°C to 200°C (-40°F to 392°F) or for soldering operations up to 260°C (500°F) for 1 to 2 minutes

Product Details

Property Average Result
Viscosity 1,500 cP (1,500 mPa*s)
Work Time 11 hours
Appearance Clear
Cure 30 minutes / 150 °C
Cure System Platinum
Durometer 15 Type 00
Mix Ratio 1:1
Operating Temperature -40 °C / 200 °C
Refractive Index 1.38
Specific Gravity 1.28
Volatile Content 0.14 %
Comment Resistant to hydrocarbon solvents. Index matches Magnesium Fluoride. Potlife based on 3,000 cPs maximum mixed viscosity after 6hrs

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.