EPM-2482

LOW VOLATILITY DIELECTRIC SILICONE GEL

Description

  • Two-part, clear silicone gel
  • Designed for enhanced performance in extreme low and high temperatures
  • 1:1 Mix Ratio (Part A: Part B)

Applications

  • For applications requiring low volatility
  • Useful for potting intricate assemblies due to a low viscosity
  • As a low modulus embedding or potting compound for environmental protection of electronic assemblies and components

Product Details

Property Average Result
Viscosity 1,800 cP (1,800 mPa*s)
Penetration 3 mm
Appearance Clear
Cure 40 minutes / 150 °C
Cure System Platinum
Ionic Content Cl <5 ppm
Ionic Content K <1 ppm
Ionic Content Na <4 ppm
Mix Ratio 1:1
Volatile Content 0.3 %
Comment Soft High Tack Gel;For applications requiring low volatility. Useful for potting intricate assemblies due to a low viscosity. As a low modulus embedding or potting compound for environmental protection of electronic assemblies and components

Encapsulation Technology

Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.

Learn more

The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.