EPM-2480

DIELECTRIC SILICONE GEL

Description

  • Two-part, clear silicone gel
  • 1:1 Mix Ratio
  • (Part A: Part B)

Applications

  • For applications requiring low volatility
  • Useful for potting intricate assemblies due to a low viscosity
  • As an embedding or potting compound for environmental protection of electronic assemblies and components

Product Details

Property Average Result
Viscosity 2,500 cP (2,500 mPa*s)
Penetration 4 mm
Work Time 30 hours
Appearance Clear
Cure 30 minutes / 150 °C
Cure System Platinum
Ionic Content Cl <5 ppm
Ionic Content K <1 ppm
Ionic Content Na <2 ppm
Mix Ratio 1:1
Volume Resistivity 100,000,000,000,000 ohmcm
Comment Soft High Tack Gel

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.