CV-2963

THERMALLY CONDUCTIVE, CONTROLLED VOLATILITY RTV SILICONE

Description

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • 20:1 Mix Ratio (Part A: Part B)

Applications

  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
  • For applications requiring a broader operating temperature range
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average Result
Thermal Conductivity 0.64 W/(mK)
Cure System Platinum
Tensile 425 psi (2.93 MPa)
Appearance White
Cure 4 hours / 65 °C
Durometer 60 Type A
Elongation 250 %
Lap Shear 275 psi (1.9 MPa)
Mix Ratio 20:1
Specific Gravity 1.27
Tear 50 ppi (8.82 kN/m)
Work Time 2 hours
Comment Primed w/CF1-135, Contains Boron Nitride

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.