CV-2948

THERMALLY CONDUCTIVE, CONTROLLED VOLATILITY RTV SILICONE

Description

  • Two-part, white, thermally conductive RTV silicone
  • 100:0.2 Mix Ratio (Base: Curing Agent)
  • Designed for enhanced performance in extreme low and high temperatures

Applications

  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
  • For applications requiring a broader operating temperature range
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average Result
Thermal Conductivity 1.95 W/(mK)
Cure System Alkoxy
Tensile 250 psi (1.72 MPa)
Appearance White
Cure 7 days / RTV
Durometer 80 Type A
Elongation 30 %
Lap Shear 150 psi (1.03 MPa)
Mix Ratio 100:0.2
Specific Gravity 1.57
Tear 45 ppi (7.94 kN/m)
Work Time 2.5 hours
Comment *22) 2.0 W/mK, *3) Primed Lap Shear 150 psi (1.0 MPa)

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.