Description
- A two-part silicone system
- Provided in mix and dispense applicators
- 1:1 Mix Ratio (Part A:B)
Applications
- For applications requiring a rapid cure and easy application
- Useful for potting, encapsulating and replicating surfaces and devices
- Ideal for providing protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust and other contaminants
- Ideal for molding or use in O-rings, potting connectors, cable harness breakouts, molded high voltage terminals, seals, and gaskets
Product Details
| Property | Average Result |
|---|---|
| Cure System | Platinum |
| Viscosity | 75,000 cP (75,000 mPa*s) |
| Durometer | 25 Type A |
| Tensile | 1,100 psi (7.59 MPa) |
| Elongation | 600 % |
| Appearance | Translucent |
| Cure | 30 minutes / 150 °C |
| Mix Ratio | 1:1 |
| Refractive Index | 1.40 |
| Specific Gravity | 1.11 |
| Tear | 80 ppi (14.11 kN/m) |
| Work Time | 15 minutes |
| Comment | Dielectric properties are excellent for actuators and other applications where dielectric properties are critical |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.